PPS' IC Bonding Sensor System offers an eco-friendly, re-usable and dynamic pressure sensing system to monitor bonding processes for interconnections of integrated circuits (IC) as well as for Anisotropic Conductive Films (ACF). The IC Bonding Sensor System is a high resolution sensor that captures pressure distribution over contact surface areas during high temperature and high pressure bonding processes. It provides real-time visual and quantifiable data along with thermal compensation for accurate measurements. Replace costly and environmentally unfriendly Fuji Prescale film used in IC and display electrical connection bonding with PPS' IC Bonding Sensor System.
Anisotropoic Conductive Film (ACF)
Anisotropic Conductive Film (ACF) is used to make high density electrical connections for IC fabrication, flat screen assembly, or whenever a large number of fine-pitch electrical connections must be made. During ACF bonding, a great deal of thermal and pressure transients is applied when the a hot blade or tool makes contact with the materials being laminated. This operating environment poses a challenge to collecting usable measurements. PPS’ new IC Bonding Sensor System lets process operators collect usable force/pressure data at actual bonding temperatures.
PPS Tactile Bonding Sensor Advantages
- Dynamic real-time visualization for adjustment and alignment of bonding processes
- Thermal compensation for accurate data collection
- Industrial construction for conditions involving high temperatures and high pressures
- Accurate quantitative system that can be integrated into the bonding machine
